Købe 1810-DG-225-RC med BYCHPS
Køb med garanti
1810-DG-225-RC
- Varenummer:
- 1810-DG-225-RC
- Fabrikant:
- Critical Link
- Beskrivelse:
- MITYDSP-1810F SOM OMAP-L138
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12991 Pieces
- Datablad:
- 1810-DG-225-RC.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 1810-DG-225-RC, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 1810-DG-225-RC via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Fart: | 375MHz |
|---|---|
| Størrelse / Dimension: | 2.66" x 2" (67.6mm x 50.8mm) |
| Serie: | MitySOM |
| RAM-størrelse: | 8KB (Internal), 128MB (External) |
| Andre navne: | 1810DG225RC |
| Driftstemperatur: | 0°C ~ 70°C |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Modul / Board Type: | MPU, FPGA Core |
| Producentens varenummer: | 1810-DG-225-RC |
| Flash størrelse: | 256MB (NAND), 8MB (NOR) |
| Udvidet beskrivelse: | MitySOM Embedded Module ARM926EJ-S, AM1810 Spartan-6, XC6SLX16 375MHz 8KB (Internal), 128MB (External) 256MB (NAND), 8MB (NOR) |
| Beskrivelse: | MITYDSP-1810F SOM OMAP-L138 |
| Core Processor: | ARM926EJ-S, AM1810 |
| Tilslutningstype: | SO-DIMM-200 |
| Co-processor: | Spartan-6, XC6SLX16 |
| Email: | [email protected] |
Relaterede dele til 1810-DG-225-RC
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CC-MX-LB69-GMD | Digi International | CONNECTCORE | Forespørgsel |
 |
TE0725LP-01-100-2C | Trenz Electronic GmbH | SOM ARTIX-7 XC7A100T-2C FLASH | Forespørgsel |
 |
CC-7U-Z113-Z1 | Digi International | MODULE 7U 16MB SDRAM 8MB FLASH | Forespørgsel |
 |
20-101-0518 | Digi International | MODULE RABBITCORE RCM3110 | Forespørgsel |
 |
1810-DX-225-RC | Critical Link LLC | MITYDSP-1810 SOM OMAP-L138 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog