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1904045-3
- Varenummer:
- 1904045-3
- Beskrivelse:
- V23333Z0002A010-EV-000
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14034 Pieces
- Datablad:
- 1904045-3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 1904045-3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 1904045-3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | V23333Z0002A010-EV-000 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | 1904045-3 |
| Udvidet beskrivelse: | Relay |
| Beskrivelse: | V23333Z0002A010-EV-000 |
| Email: | [email protected] |
Relaterede dele til 1904045-3
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
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1904056-2 | TE Connectivity Potter & Brumfield Relays | V23134A0007X936-EV-441 | Forespørgsel |
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1904045-5 | TE Connectivity Potter & Brumfield Relays | V23333Z1001B045-EV-000 | Forespørgsel |
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1904045-7 | TE Connectivity Potter & Brumfield Relays | V23333Z0002B049-EV-000 | Forespørgsel |
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1904001-5 | TE Connectivity Potter & Brumfield Relays | AUTOMOTIVE RELAYS | Forespørgsel |
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1904045-4 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A041-EV-000 | Forespørgsel |
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1904045-2 | TE Connectivity Potter & Brumfield Relays | V23333Z1001A008-EV-000 | Forespørgsel |
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1904045-1 | TE Connectivity Potter & Brumfield Relays | V23333Z0001A007-EV-000 | Forespørgsel |
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1904045-6 | TE Connectivity Potter & Brumfield Relays | V23333Z0001B046-EV-000 | Forespørgsel |
|
1904002-2 | TE Connectivity Potter & Brumfield Relays | RELAY AUTO SPST-NO 50A 24V | Forespørgsel |
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1904001-2 | TE Connectivity Potter & Brumfield Relays | RELAY AUTO SPST-NO 75A 12V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers