Købe 2-2176075-9 med BYCHPS
Køb med garanti
2-2176075-9
- Varenummer:
- 2-2176075-9
- Fabrikant:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- FIXED IND 2.9NH 150MA 1 OHM SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17081 Pieces
- Datablad:
- 1.2-2176075-9.pdf2.2-2176075-9.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 2-2176075-9, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 2-2176075-9 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Thin Film |
|---|---|
| Tolerance: | ±0.2nH |
| Leverandør Device Package: | 0201 |
| Størrelse / Dimension: | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
| Afskærmning: | Unshielded |
| Serie: | 3640, Sigma Inductors |
| Vurderinger: | - |
| Q @ Freq: | 8 @ 500MHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0201 (0603 Metric) |
| Andre navne: | 36401H2N9ATDF A115961TR |
| Driftstemperatur: | - |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | - |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | 2-2176075-9 |
| selvinduktion: | 2.9nH |
| Frekvens - Test: | 500MHz |
| Frekvens - Selvresonans: | 6GHz |
| Udvidet beskrivelse: | 2.9nH Unshielded Thin Film Inductor 150mA 1 Ohm Max 0201 (0603 Metric) |
| Beskrivelse: | FIXED IND 2.9NH 150MA 1 OHM SMD |
| DC-resistens (DCR): | 1 Ohm Max |
| Nuværende vurdering: | 150mA |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til 2-2176075-9
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers