Købe 227DCR2R3SNI med BYCHPS
Køb med garanti
227DCR2R3SNI
- Varenummer:
- 227DCR2R3SNI
- Fabrikant:
- Illinois Capacitor
- Beskrivelse:
- CAP 220F -20%, +50% 2.3V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16150 Pieces
- Datablad:
- 227DCR2R3SNI.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 227DCR2R3SNI, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 227DCR2R3SNI via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.3V |
|---|---|
| Tolerance: | -20%, +50% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.866" Dia (22.00mm) |
| Serie: | DCR |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Snap-In |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | 227DCR2R3SNI |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Blyafstand: | 0.394" (10.00mm) |
| Højde - Siddende (Max): | 1.929" (49.00mm) |
| Udvidet beskrivelse: | 220F -20%, +50%(EDLC) Supercapacitor 2.3V Radial, Can - Snap-In 25 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 25 mOhm @ 1kHz |
| Beskrivelse: | CAP 220F -20%, +50% 2.3V T/H |
| kapacitans: | 220F |
| Email: | [email protected] |
Relaterede dele til 227DCR2R3SNI
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
JUC0E106MPD | Nichicon | CAP 10F 20% 2.5V THROUGH HOLE | Forespørgsel |
 |
JJC0E476MELA | Nichicon | CAP 47F 20% 2.5V THROUGH HOLE | Forespørgsel |
|
JUC0E225MPD | Nichicon | CAP 2.2F 20% 2.5V THROUGH HOLE | Forespørgsel |
 |
305DER2R5SFJG | Illinois Capacitor | CAP 3F -20%, +50% 2.5V TH | Forespørgsel |
 |
EEC-RF0H684 | Panasonic Electronic Components | CAP 680MF -20% +80% 5.5V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog