Købe 23FD3303A-F med BYCHPS
Køb med garanti
23FD3303A-F
- Varenummer:
- 23FD3303A-F
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP FILM 3UF 10% 330VAC SNAP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18988 Pieces
- Datablad:
- 23FD3303A-F.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 23FD3303A-F, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 23FD3303A-F via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 330V |
| Tolerance: | ±10% |
| Afslutning: | Quick Connect, Disconnect |
| Størrelse / Dimension: | 1.875" Dia x 2.380" L (47.63mm x 60.45mm) |
| Serie: | MPF |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Snap-In |
| Driftstemperatur: | -40°C ~ 70°C |
| Monteringstype: | Chassis Mount, Requires Holder/Bracket |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 23FD3303A-F |
| Blyafstand: | 0.813" (20.64mm) |
| Højde - Siddende (Max): | - |
| Funktioner: | - |
| Udvidet beskrivelse: | 3µF ±10% Film Capacitor 330V Polypropylene (PP), Metallized Radial, Can - Snap-In |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 3UF 10% 330VAC SNAP |
| kapacitans: | 3µF |
| Applikationer: | Motor Run; Power Factor Correction (PFC) |
| Email: | [email protected] |
Relaterede dele til 23FD3303A-F
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers