Købe 27E447 med BYCHPS
Køb med garanti
27E447
- Varenummer:
- 27E447
- Beskrivelse:
- RELAY SOCKET 4 POLE SOLDER
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14677 Pieces
- Datablad:
- 27E447.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 27E447, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 27E447 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Socket |
|---|---|
| Afslutningsstil: | Solder Lug |
| Serie: | R10 |
| Andre navne: | 4-1393143-2 |
| Antal positioner: | 16 |
| Monteringstype: | Chassis Mount |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 27E447 |
| Til brug med / relaterede produkter: | R10 Series |
| Funktioner: | Grounding Strip |
| Udvidet beskrivelse: | Relay Socket Chassis Mount |
| Beskrivelse: | RELAY SOCKET 4 POLE SOLDER |
| Email: | [email protected] |
Relaterede dele til 27E447
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
6-1415035-1 | TE Connectivity Potter & Brumfield Relays | SOCKET 5MM W/SCREW TERM DIN | Forespørgsel |
 |
27E448 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET 6 POLE SOLDER | Forespørgsel |
 |
PY08-QN | Omron Automation and Safety | SOCKET BACK-CONNECTING FOR MY | Forespørgsel |
 |
JRS400200 | Amphenol PCD | QUICK MOUNT, 4 POLE | Forespørgsel |
 |
27E446 | TE Connectivity Potter & Brumfield Relays | SOCKET FLANGE MNT DP R10 SERIES | Forespørgsel |
 |
JW2-PS | Panasonic Electric Works | SOCKET PCB FOR JW2 RELAYS | Forespørgsel |
|
RSE116693 | Amphenol PCD | LOW PROFILE, 2 POLE/10 AMP, WC | Forespørgsel |
|
154746-1 | TE Connectivity Potter & Brumfield Relays | RELAY BASE HSG. NATURAL | Forespørgsel |
|
RSE116761 | Amphenol PCD | LOW PROFILE, 6 POLE/10 AMP, WC | Forespørgsel |
 |
P7LF-06 | Omron Electronics Inc-EMC Div | RELAY SOCKET SCREW FOR G7L SER | Forespørgsel |
 |
03540551Z | Littelfuse Inc. | RELAY SOCKET HOUSING 280 MICRO | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog