Købe 28A0350-0B2 med BYCHPS
Køb med garanti
28A0350-0B2
- Varenummer:
- 28A0350-0B2
- Beskrivelse:
- FERRITE CORE 240 OHM HINGED
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13020 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 28A0350-0B2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 28A0350-0B2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | 28 |
| Vurderinger: | - |
| Ydermål: | 0.512" W x 0.460" H (13.00mm x 11.70mm) |
| Andre navne: | 240-2233 28A03500B2 |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 28A0350-0B2 |
| Længde: | 1.004" (25.50mm) |
| Indvendig Dimension: | 0.193" Dia (4.90mm) |
| Impedans @ Frekvens: | 240 Ohm @ 100MHz |
| Udvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core 240 Ohm @ 100MHz ID 0.193" Dia (4.90mm) OD 0.512" W x 0.460" H (13.00mm x 11.70mm) Length 1.004" (25.50mm) |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE 240 OHM HINGED |
| Email: | [email protected] |
Relaterede dele til 28A0350-0B2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
AB 3X2X3DY | Toshiba Semiconductor and Storage | FERRITE CORE SOLID | Forespørgsel |
 |
74278021 | Wurth Electronics Inc. | FERRITE CORE 58 OHM SOLID | Forespørgsel |
 |
28A0392-0A2 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM HINGED | Forespørgsel |
 |
28B1020-100 | Laird-Signal Integrity Products | FERRITE CORE 276 OHM SOLID | Forespørgsel |
 |
28A0392-0A0 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM HINGED | Forespørgsel |
 |
28A0593-0A2 | Laird-Signal Integrity Products | FERRITE CORE 407 OHM HINGED | Forespørgsel |
 |
ESD-R-14C | KEMET | FERRITE CORE SOLID 7MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog