Købe 28R1467-000 med BYCHPS
Køb med garanti
28R1467-000
- Varenummer:
- 28R1467-000
- Beskrivelse:
- FERRITE CORE 212 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12047 Pieces
- Datablad:
- 1.28R1467-000.pdf2.28R1467-000.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 28R1467-000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 28R1467-000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Flat |
|---|---|
| Serie: | 28 |
| Vurderinger: | - |
| Ydermål: | 1.457" W x 0.305" H (37.00mm x 7.75mm) |
| Andre navne: | 240-2232 |
| Monteringstype: | Free Hanging |
| Materiale: | 28 |
| Producentens varenummer: | 28R1467-000 |
| Længde: | 0.984" (25.00mm) |
| Indvendig Dimension: | 1.224" W x 0.059" H (31.08mm x 1.50mm) |
| Impedans @ Frekvens: | 212 Ohm @ 100MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 212 Ohm @ 100MHz ID 1.224" W x 0.059" H (31.08mm x 1.50mm) OD 1.457" W x 0.305" H (37.00mm x 7.75mm) Length 0.984" (25.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 212 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til 28R1467-000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
28R1418-000 | Laird-Signal Integrity Products | FERRITE CORE 104 OHM SOLID | Forespørgsel |
 |
28R1457-400 | Laird-Signal Integrity Products | FERRITE CORE 140 OHM SOLID | Forespørgsel |
 |
ESD-R-10E | KEMET | FERRITE CORE SOLID 5MM | Forespørgsel |
|
28R1476-100 | Laird-Signal Integrity Products | FERRITE CORE 110 OHM SOLID | Forespørgsel |
 |
28R1450-100 | Laird-Signal Integrity Products | FERRITE CORE 130 OHM SOLID | Forespørgsel |
|
28R1496-000 | Laird-Signal Integrity Products | FERRITE CORE 239 OHM SOLID | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers