Købe 28R1862-000 med BYCHPS
Køb med garanti
28R1862-000
- Varenummer:
- 28R1862-000
- Beskrivelse:
- FERRITE CORE 261 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13204 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 28R1862-000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 28R1862-000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Flat |
|---|---|
| Serie: | 28 |
| Vurderinger: | - |
| Ydermål: | 1.878" W x 0.590" H (47.70mm x 15.00mm) |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 28R1862-000 |
| Længde: | 1.220" (31.00mm) |
| Indvendig Dimension: | 1.535" W x 0.118" H (39.00mm x 3.00mm) |
| Impedans @ Frekvens: | 261 Ohm @ 100MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 261 Ohm @ 100MHz ID 1.535" W x 0.118" H (39.00mm x 3.00mm) OD 1.878" W x 0.590" H (47.70mm x 15.00mm) Length 1.220" (31.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 261 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til 28R1862-000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
28B0355-000 | Laird-Signal Integrity Products | FERRITE CORE 205 OHM SOLID | Forespørgsel |
 |
28R1861-000 | Laird-Signal Integrity Products | FERRITE CORE 244 OHM SOLID | Forespørgsel |
 |
KR16TT140620 | Panasonic - DTG | FERRITE CORE 140 OHM SOLID 6.4MM | Forespørgsel |
 |
28R1800-010 | Laird-Signal Integrity Products | FERRITE CORE 260 OHM SOLID | Forespørgsel |
 |
28B0631-100 | Laird-Signal Integrity Products | FERRITE CORE 243 OHM SOLID | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers