Købe 35TGV1800M18X21.5 med BYCHPS
Køb med garanti
35TGV1800M18X21.5
- Varenummer:
- 35TGV1800M18X21.5
- Fabrikant:
- Rubycon
- Beskrivelse:
- CAP ALUM 1800UF 20% 35V SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17902 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 35TGV1800M18X21.5, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 35TGV1800M18X21.5 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 35V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | 0.748" L x 0.748" W (19.00mm x 19.00mm) |
| Størrelse / Dimension: | 0.709" Dia (18.00mm) |
| Serie: | TGV |
| Ripple Current: | 1.08A |
| Polarisering: | Polar |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Radial, Can - SMD |
| Andre navne: | 1189-2689-2 35TGV1800M018X21.5 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | 35TGV1800M18X21.5 |
| Levetid @ Temp.: | 5000 Hrs @ 125°C |
| Blyafstand: | - |
| Impedans: | - |
| Højde - Siddende (Max): | 0.866" (22.00mm) |
| Udvidet beskrivelse: | 1800µF 35V Aluminum Capacitors Radial, Can - SMD 39 mOhm @ 100kHz 5000 Hrs @ 125°C |
| ESR (Equivalent Series Resistance): | 39 mOhm @ 100kHz |
| Beskrivelse: | CAP ALUM 1800UF 20% 35V SMD |
| kapacitans: | 1800µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til 35TGV1800M18X21.5
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers