Købe 36320-502 med BYCHPS
Køb med garanti
36320-502
- Varenummer:
- 36320-502
- Beskrivelse:
- COIL KIT 20-40A 208
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15245 Pieces
- Datablad:
- 36320-502.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 36320-502, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 36320-502 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | 1611414-1 36320502 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | 36320-502 |
| Udvidet beskrivelse: | |
| Beskrivelse: | COIL KIT 20-40A 208 |
| Email: | [email protected] |
Relaterede dele til 36320-502
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
36320-501 | TE Connectivity Potter & Brumfield Relays | COIL KIT 20-40A 120V | Forespørgsel |
 |
J73KN-D-22F | Omron Automation and Safety | AUX CONTACT BLOCK 2NO+2NC | Forespørgsel |
|
36320-543 | TE Connectivity Potter & Brumfield Relays | COIL KIT 20-40A 24VA | Forespørgsel |
 |
CNS129900 | Amphenol PCD | SOCKET CONTACT SZ12/16 | Forespørgsel |
|
P2RM-SB | Omron Automation and Safety | SOCKET BRIDGE DC FOR P2RF | Forespørgsel |
|
R99-11 FOR MY(NAMEPLATE) | Omron Automation and Safety | NAMEPLATE FOR MY | Forespørgsel |
|
36320-503 | TE Connectivity Potter & Brumfield Relays | COIL KIT 20-40A 480V | Forespørgsel |
|
36320-530 | TE Connectivity Potter & Brumfield Relays | COIL KIT 20-40A 277V | Forespørgsel |
 |
8869580000 | Weidmuller | RIM-I 1 6/230V | Forespørgsel |
 |
SSA-24C667 | TE Connectivity Potter & Brumfield Relays | MOUNTING CLIP CNT SERIES | Forespørgsel |
|
36320-503B | TE Connectivity Potter & Brumfield Relays | COIL KIT 480VAC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers