Købe 36502A33NJTDG med BYCHPS
Køb med garanti
36502A33NJTDG
- Varenummer:
- 36502A33NJTDG
- Fabrikant:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- FIXED IND 33NH 500MA 270 MOHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12520 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 36502A33NJTDG, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 36502A33NJTDG via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±5% |
| Leverandør Device Package: | 0907 (2317 Metric) |
| Størrelse / Dimension: | 0.090" L x 0.068" W (2.29mm x 1.73mm) |
| Afskærmning: | Unshielded |
| Serie: | 3650, Sigma Inductors |
| Vurderinger: | - |
| Q @ Freq: | 60 @ 500MHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Nonstandard |
| Andre navne: | 3-1624113-6 316241136 A103782TR |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | - |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | 36502A33NJTDG |
| selvinduktion: | 33nH |
| Højde - Siddende (Max): | 0.060" (1.52mm) |
| Frekvens - Test: | 250MHz |
| Frekvens - Selvresonans: | 2.05GHz |
| Udvidet beskrivelse: | 33nH Unshielded Wirewound Inductor 500mA 270 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 33NH 500MA 270 MOHM |
| DC-resistens (DCR): | 270 mOhm Max |
| Nuværende vurdering: | 500mA |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til 36502A33NJTDG
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers