Købe 3EX272K3 med BYCHPS
Køb med garanti
3EX272K3
- Varenummer:
- 3EX272K3
- Fabrikant:
- Semtech
- Beskrivelse:
- CAP CER 2700PF 3KV X7R RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12371 Pieces
- Datablad:
- 3EX272K3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 3EX272K3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 3EX272K3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 3000V (3kV) |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | - |
| Temperaturkoefficient: | X7R |
| Størrelse / Dimension: | 0.500" L x 0.300" W (12.70mm x 7.62mm) |
| Serie: | - |
| Vurderinger: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | 3EX272K3 |
| Lead Style: | Straight |
| Blyafstand: | 0.402" (10.20mm) |
| Højde - Siddende (Max): | 0.575" (14.60mm) |
| Funktioner: | High Voltage |
| Udvidet beskrivelse: | 2700pF ±10% 3000V (3kV) Ceramic Capacitor X7R Radial |
| Beskrivelse: | CAP CER 2700PF 3KV X7R RADIAL |
| kapacitans: | 2700pF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til 3EX272K3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers