Købe 3SBC2020A2 med BYCHPS
Køb med garanti
3SBC2020A2
- Varenummer:
- 3SBC2020A2
- Beskrivelse:
- RELAY GENERAL PURPOSE DPDT 2A 9V
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12119 Pieces
- Datablad:
- 3SBC2020A2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 3SBC2020A2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 3SBC2020A2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 4.4 VDC |
|---|---|
| Sluk spænding (Min): | 0.5 VDC |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 115VAC, 28VDC - Max |
| Serie: | Military, MIL-R-39016/13, 3SBC, CII |
| Udgivelsestid: | 4ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 2-1617073-2 2-1617073-2-MIL 3SBC2020A2-MIL M39016/13-075P M39016/13-075P-MIL |
| Driftstemperatur: | -65°C ~ 125°C |
| Brug tid: | 4ms |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 21 Weeks |
| Producentens varenummer: | 3SBC2020A2 |
| Funktioner: | Sealed - Hermetically |
| Udvidet beskrivelse: | General Purpose Relay DPDT (2 Form C) Through Hole |
| Beskrivelse: | RELAY GENERAL PURPOSE DPDT 2A 9V |
| Kontakt Rating (Aktuel): | 2A |
| Kontaktmateriale: | - |
| Kontaktformular: | DPDT (2 Form C) |
| Spole spænding: | 9VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 140 Ohms |
| Coil Power: | - |
| Email: | [email protected] |
Relaterede dele til 3SBC2020A2
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog