Købe 3SBM1070A2 med BYCHPS
Køb med garanti
3SBM1070A2
- Varenummer:
- 3SBM1070A2
- Beskrivelse:
- RELAY GEN PURPOSE 4PDT 2A 26.5V
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16190 Pieces
- Datablad:
- 3SBM1070A2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 3SBM1070A2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 3SBM1070A2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | - |
|---|---|
| Sluk spænding (Min): | - |
| Afslutningsstil: | - |
| Skiftespænding: | 115VAC, 28VDC - Max |
| Serie: | Military, MIL-R-39016/31, 3SBM, CII |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 1617086-5 1617086-5-MIL 3SBM1070A2-MIL M39016/31-002M M39016/31-002M-MIL |
| Driftstemperatur: | - |
| Monteringstype: | - |
| Fabrikantens standard ledetid: | 21 Weeks |
| Producentens varenummer: | 3SBM1070A2 |
| Funktioner: | - |
| Udvidet beskrivelse: | General Purpose Relay 4PDT (4 Form C) |
| Beskrivelse: | RELAY GEN PURPOSE 4PDT 2A 26.5V |
| Kontakt Rating (Aktuel): | 2A |
| Kontaktmateriale: | - |
| Kontaktformular: | 4PDT (4 Form C) |
| Spole spænding: | 26.5VDC |
| Spole type: | Latching, Dual Coil |
| Coil Resistance: | - |
| Coil Power: | - |
| Email: | [email protected] |
Relaterede dele til 3SBM1070A2
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers