Købe 450LSG2200M64X119 med BYCHPS
Køb med garanti
450LSG2200M64X119
- Varenummer:
- 450LSG2200M64X119
- Fabrikant:
- Rubycon
- Beskrivelse:
- SCREW TERMINAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15591 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 450LSG2200M64X119, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 450LSG2200M64X119 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 450LSG2200M64X119 |
| Udvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | SCREW TERMINAL |
| Email: | [email protected] |
Relaterede dele til 450LSG2200M64X119
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
450LSG2200M64X109 | Rubycon | SCREW TERMINAL | Forespørgsel |
 |
450LSG3300MEFC64X149 | Rubycon | CAP ALUM 3300UF 20% 450V SCREW | Forespørgsel |
 |
6.3ZL330MEFCTA6.3X11 | Rubycon | CAP ALUM 330UF 20% 6.3V RADIAL | Forespørgsel |
|
450LSG1500M51X118 | Rubycon | SCREW TERMINAL | Forespørgsel |
 |
LXY16VB821M10X25LL | United Chemi-Con | CAP ALUM 820UF 20% 16V RADIAL | Forespørgsel |
 |
450LSG3900MNB77X121 | Rubycon | CAP ALUM 3900UF 20% 450V SCREW | Forespørgsel |
|
450LSG3900MEFC77X121 | Rubycon | SCREW TERMINAL | Forespørgsel |
|
450LSG6800M77X191 | Rubycon | SCREW TERMINAL | Forespørgsel |
 |
MALREKA00AA147LL0K | Vishay BC Components | CAP ALUM 4.7UF 20% 100V RADIAL | Forespørgsel |
 |
450LSG1000MNB51X98 | Rubycon | CAP ALUM 1000UF 20% 450V SCREW | Forespørgsel |
|
450LSG3300MNB64X149 | Rubycon | CAP ALUM 3300UF 20% 450V SCREW | Forespørgsel |
|
450LSG1000MEFC51X98 | Rubycon | CAP ALUM 1000UF 20% 450V SCREW | Forespørgsel |
 |
450LSG10000MEFC90X221 | Rubycon | CAP ALUM 10000UF 20% 450V SCREW | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog