Købe 55081013400 med BYCHPS
Køb med garanti
55081013400
- Varenummer:
- 55081013400
- Fabrikant:
- Sumida Corporation
- Beskrivelse:
- FIXED IND 100NH 350MA 260 MOHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15882 Pieces
- Datablad:
- 55081013400.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 55081013400, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 55081013400 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±5% |
| Leverandør Device Package: | 0805 (2012 Metric) |
| Størrelse / Dimension: | 0.087" L x 0.055" W (2.20mm x 1.40mm) |
| Afskærmning: | Unshielded |
| Serie: | 5508 |
| Vurderinger: | - |
| Q @ Freq: | 40 @ 150MHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0805 (2012 Metric) |
| Andre navne: | 308-1726-2 5508 101 34 00 55081013400-ND |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Ceramic |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | 55081013400 |
| selvinduktion: | 100nH |
| Højde - Siddende (Max): | 0.056" (1.42mm) |
| Frekvens - Test: | 150MHz |
| Frekvens - Selvresonans: | 1.31GHz |
| Udvidet beskrivelse: | 100nH Unshielded Wirewound Inductor 350mA 260 mOhm Max 0805 (2012 Metric) |
| Beskrivelse: | FIXED IND 100NH 350MA 260 MOHM |
| DC-resistens (DCR): | 260 mOhm Max |
| Nuværende vurdering: | 350mA |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til 55081013400
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers