Købe 564RT3MRR202EG681K med BYCHPS
Køb med garanti
564RT3MRR202EG681K
- Varenummer:
- 564RT3MRR202EG681K
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP CER 680PF 2KV RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19363 Pieces
- Datablad:
- 564RT3MRR202EG681K.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 564RT3MRR202EG681K, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 564RT3MRR202EG681K via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2000V (2kV) |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | - |
| Temperaturkoefficient: | - |
| Størrelse / Dimension: | - |
| Serie: | Cera-Mite 564R |
| Vurderinger: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Disc |
| Driftstemperatur: | -25°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 22 Weeks |
| Producentens varenummer: | 564RT3MRR202EG681K |
| Lead Style: | Straight |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Low Dissipation Factor |
| Fejlrate: | - |
| Udvidet beskrivelse: | 680pF ±10% 2000V (2kV) Ceramic Capacitor Radial, Disc |
| Beskrivelse: | CAP CER 680PF 2KV RADIAL |
| kapacitans: | 680pF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til 564RT3MRR202EG681K
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
564RT3MRR202EE391K | Vishay BC Components | CAP CER 390PF 2KV RADIAL | Forespørgsel |
|
564RT3MRR202EE181K | Vishay BC Components | CAP CER 180PF 2KV RADIAL | Forespørgsel |
|
564RT3MRR202EF471K | Vishay BC Components | CAP CER 470PF 2KV RADIAL | Forespørgsel |
|
564RT3MRR202EE331K | Vishay BC Components | CAP CER 330PF 2KV RADIAL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers