Købe 5M2210ZF324C4N med BYCHPS
Køb med garanti
5M2210ZF324C4N
- Varenummer:
- 5M2210ZF324C4N
- Fabrikant:
- Altera (Intel)
- Beskrivelse:
- IC CPLD 1700MC 7NS 324FBGA
- Blyfri Status / RoHS Status:
- Leverandør udefineret / RoHS-kompatibel
- Tilgængelig mængde:
- 13079 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 5M2210ZF324C4N, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 5M2210ZF324C4N via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsforsyning - Intern: | 1.71 V ~ 1.89 V |
|---|---|
| Leverandør Device Package: | 324-FBGA (19x19) |
| Serie: | MAX® V |
| Programmerbar Type: | In System Programmable |
| Emballage: | Tray |
| Pakke / tilfælde: | 324-LBGA |
| Driftstemperatur: | 0°C ~ 85°C (TJ) |
| Antal makroceller: | 1700 |
| Antal logiske elementer / blokke: | 2210 |
| Antal I / O: | 271 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | 5M2210ZF324C4N |
| Beskrivelse: | IC CPLD 1700MC 7NS 324FBGA |
| Forsinkelsestid tpd (1) Maks: | 7.0ns |
| Email: | [email protected] |
Relaterede dele til 5M2210ZF324C4N
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
5M2210ZF256I5 | Altera | IC CPLD 1700MC 7NS 256FBGA | Forespørgsel |
 |
5M2210ZF324I5N | Altera | IC CPLD 1700MC 7NS 324FBGA | Forespørgsel |
|
5M2210ZF256I5N | Altera | IC CPLD 1700MC 7NS 256FBGA | Forespørgsel |
|
5M2210ZF256C4N | Altera | IC CPLD 1700MC 7NS 256FBGA | Forespørgsel |
|
5M2210ZF324C5N | Altera | IC CPLD 1700MC 7NS 324FBGA | Forespørgsel |
|
5M2210ZF324I5 | Altera | IC CPLD 1700MC 7NS 324FBGA | Forespørgsel |
|
5M2210ZF256C5N | Altera | IC CPLD 1700MC 7NS 256FBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers