Købe 5SGSMD4E3H29C2LN med BYCHPS
Køb med garanti
5SGSMD4E3H29C2LN
- Varenummer:
- 5SGSMD4E3H29C2LN
- Fabrikant:
- Altera (Intel)
- Beskrivelse:
- IC FPGA 360 I/O 780HBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19826 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for 5SGSMD4E3H29C2LN, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 5SGSMD4E3H29C2LN via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 0.82 V ~ 0.88 V |
|---|---|
| Samlet RAM-bit: | 23946240 |
| Leverandør Device Package: | 780-HBGA (33x33) |
| Serie: | Stratix® V GS |
| Pakke / tilfælde: | 780-BBGA, FCBGA |
| Driftstemperatur: | 0°C ~ 85°C (TJ) |
| Antal logiske elementer / celler: | 360000 |
| Antal LAB'er / CLB'er: | 135840 |
| Antal I / O: | 360 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | 5SGSMD4E3H29C2LN |
| Beskrivelse: | IC FPGA 360 I/O 780HBGA |
| Email: | [email protected] |
Relaterede dele til 5SGSMD4E3H29C2LN
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
5SGSMD4E3H29C2L | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
|
5SGSMD4E3H29I4N | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
|
5SGSMD4E3H29C4N | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
|
5SGSMD4E3H29I3L | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
|
5SGSMD4E3H29I3LN | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
|
5SGSMD4E3H29C2N | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
|
5SGSMD4E3H29I3N | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
|
5SGSMD4E3H29C3N | Altera | IC FPGA 360 I/O 780HBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers