Købe 610SJR00200 med BYCHPS
Køb med garanti
610SJR00200
- Varenummer:
- 610SJR00200
- Fabrikant:
- Ohmite
- Beskrivelse:
- RES SMD 0.002 OHM 5% 1W C BEND
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 19961 Pieces
- Datablad:
- 610SJR00200.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 610SJR00200, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 610SJR00200 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±5% |
|---|---|
| Temperaturkoefficient: | ±350ppm/°C |
| Leverandør Device Package: | SMD |
| Størrelse / Dimension: | 0.441" L x 0.126" W (11.20mm x 3.20mm) |
| Serie: | 60S |
| Modstand (ohm): | 0.002 |
| Power (Watts): | 1W |
| Emballage: | Bulk |
| Pakke / tilfælde: | Strip, C Bend |
| Andre navne: | 610SJR002 610SJR00200BK |
| Driftstemperatur: | -40°C ~ 155°C |
| Antal Afslutninger: | 2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | 610SJR00200 |
| Højde - Siddende (Max): | 0.154" (3.90mm) |
| Funktioner: | Current Sense, Flame Proof, Moisture Resistant, Safety |
| Fejlrate: | - |
| Udvidet beskrivelse: | 0.002 Ohm ±5% 1W Chip Resistor Strip, C Bend Current Sense, Flame Proof, Moisture Resistant, Safety Metal Element |
| Beskrivelse: | RES SMD 0.002 OHM 5% 1W C BEND |
| Sammensætning: | Metal Element |
| Email: | [email protected] |
Relaterede dele til 610SJR00200
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
610SJR00200-T | Ohmite | RES SMD 0.002 OHM 5% 1W C BEND | Forespørgsel |
 |
610SJR00300E-T | Ohmite | RES SMD 0.003 OHM 5% 1W C BEND | Forespørgsel |
 |
610SJR00200E | Ohmite | RES SMD 0.002 OHM 5% 1W C BEND | Forespørgsel |
|
610SJR00300 | Ohmite | RES SMD 0.003 OHM 5% 1W C BEND | Forespørgsel |
|
610SJR00200E-T | Ohmite | RES SMD 0.002 OHM 5% 1W C BEND | Forespørgsel |
|
610SJR00300E | Ohmite | RES SMD 0.003 OHM 5% 1W C BEND | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers