Købe 715P222516LD3 med BYCHPS
Køb med garanti
715P222516LD3
- Varenummer:
- 715P222516LD3
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP FILM 2200PF 5% 1.6KVDC RAD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19043 Pieces
- Datablad:
- 715P222516LD3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 715P222516LD3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 715P222516LD3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 1600V (1.6kV) |
|---|---|
| Spændingsbedømmelse - AC: | 500V |
| Tolerance: | ±5% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.350" Dia x 1.252" L (8.90mm x 31.80mm) |
| Serie: | Orange Drop® 715P |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 338-3453 |
| Driftstemperatur: | -55°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | 715P222516LD3 |
| Blyafstand: | 0.720" (18.30mm) |
| Højde - Siddende (Max): | 0.642" (16.30mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 2200pF ±5% Film Capacitor 500V 1600V (1.6kV) Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 2200PF 5% 1.6KVDC RAD |
| kapacitans: | 2200pF |
| Applikationer: | High Frequency, Switching; High Pulse, DV/DT; Snubber |
| Email: | [email protected] |
Relaterede dele til 715P222516LD3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers