Købe 72T18105L4-4BBG med BYCHPS
Køb med garanti
72T18105L4-4BBG
- Varenummer:
- 72T18105L4-4BBG
- Fabrikant:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC FIFO 131072X18 SYNC 240BGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17156 Pieces
- Datablad:
- 72T18105L4-4BBG.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 72T18105L4-4BBG, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 72T18105L4-4BBG via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.375 V ~ 2.625 V |
|---|---|
| Leverandør Device Package: | 240-PBGA (19x19) |
| Serie: | 72T |
| Retransmit Capability: | Yes |
| Programmerbar flagstøtte: | Yes |
| Emballage: | Tray |
| Pakke / tilfælde: | 240-BGA |
| Andre navne: | IDT72T18105L4-4BBG IDT72T18105L4-4BBG-ND |
| Driftstemperatur: | 0°C ~ 70°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsesstørrelse: | 2.25M (128K x 18)(256K x 9) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | 72T18105L4-4BBG |
| Fungere: | Asynchronous, Synchronous |
| FWFT Support: | Yes |
| Udvidelsestype: | Depth, Width |
| Beskrivelse: | IC FIFO 131072X18 SYNC 240BGA |
| Datahastighed: | 100MHz, 225MHz |
| Nuværende - Forsyning (Max): | 70mA |
| Bus Retningsmæssig: | Uni-Directional |
| Adgangstid: | 8ns, 3.4ns |
| Email: | [email protected] |
Relaterede dele til 72T18105L4-4BBG
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog