Købe 74LVC3G06DC,125 med BYCHPS
Køb med garanti
74LVC3G06DC,125
- Varenummer:
- 74LVC3G06DC,125
- Fabrikant:
- Nexperia
- Beskrivelse:
- IC TRIPLE INVERTER O-D 8VSSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16645 Pieces
- Datablad:
- 74LVC3G06DC,125.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 74LVC3G06DC,125, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 74LVC3G06DC,125 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.65 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 8-VSSOP, US8 |
| Serie: | 74LVC |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 8-VFSOP (0.091", 2.30mm Width) |
| Andre navne: | 1727-7038-2 568-9364-2 568-9364-2-ND 74LVC3G06DC,125-ND 74LVC3G06DC-G 74LVC3G06DC-G-ND 935275555125 |
| Driftstemperatur: | -40°C ~ 125°C |
| Antal indgange: | 3 |
| Antal kredsløb: | 3 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Maksimal forplantningsforsinkelse @ V, Max CL: | 2.9ns @ 5V, 50pF |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | 74LVC3G06DC,125 |
| Logik Type: | Inverter |
| Logisk niveau - Lav: | 0.7 V ~ 0.8 V |
| Logisk niveau - Høj: | 1.7 V ~ 2 V |
| Funktioner: | Open Drain |
| Udvidet beskrivelse: | Inverter IC 3 Channel Open Drain 8-VSSOP, US8 |
| Beskrivelse: | IC TRIPLE INVERTER O-D 8VSSOP |
| Nuværende - Quiescent (Max): | 4µA |
| Nuværende - Output High, Low: | -, 32mA |
| Email: | [email protected] |
Relaterede dele til 74LVC3G06DC,125
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers