Købe 74LVC3G17GM,125 med BYCHPS
Køb med garanti
74LVC3G17GM,125
- Varenummer:
- 74LVC3G17GM,125
- Fabrikant:
- Nexperia
- Beskrivelse:
- IC BUFF SCHMT TRG TRPL 8XQFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15020 Pieces
- Datablad:
- 74LVC3G17GM,125.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 74LVC3G17GM,125, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 74LVC3G17GM,125 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.65 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 8-XQFN (1.6x1.6) |
| Serie: | 74LVC |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 8-XFQFN Exposed Pad |
| Output Type: | Push-Pull |
| Andre navne: | 1727-7045-2 568-9371-2 568-9371-2-ND 74LVC3G17GM,125-ND 74LVC3G17GM-G 74LVC3G17GM-G-ND 74LVC3G17GM125 935277249125 |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Antal elementer: | 3 |
| Antal bit pr. Element: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | 74LVC3G17GM,125 |
| Logik Type: | Buffer, Non-Inverting |
| Input Type: | Schmitt Trigger |
| Udvidet beskrivelse: | Buffer, Non-Inverting Element 1 Bit per Element Push-Pull Output 8-XQFN (1.6x1.6) |
| Beskrivelse: | IC BUFF SCHMT TRG TRPL 8XQFN |
| Nuværende - Output High, Low: | 32mA, 32mA |
| Email: | [email protected] |
Relaterede dele til 74LVC3G17GM,125
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog