Købe 74LVCU04AD-Q100J med BYCHPS
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74LVCU04AD-Q100J
- Varenummer:
- 74LVCU04AD-Q100J
- Fabrikant:
- Nexperia
- Beskrivelse:
- IC HEX INVERTER 14SO
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15302 Pieces
- Datablad:
- 74LVCU04AD-Q100J.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 74LVCU04AD-Q100J, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 74LVCU04AD-Q100J via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Leverandør Device Package: | 14-SO |
|---|---|
| Serie: | 74LVCU |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 14-SOIC (0.154", 3.90mm Width) |
| Andre navne: | 935304498118 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | 74LVCU04AD-Q100J |
| Udvidet beskrivelse: | IC Channel 14-SO |
| Beskrivelse: | IC HEX INVERTER 14SO |
| Email: | [email protected] |
Relaterede dele til 74LVCU04AD-Q100J
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
74LVCU04ADB,112 | Nexperia USA Inc. | IC HEX INVERTER 14SSOP | Forespørgsel |
 |
74LVCU04APW,118 | Nexperia USA Inc. | IC HEX INVERTER 14TSSOP | Forespørgsel |
|
74LVCU04APW-Q100J | Nexperia USA Inc. | IC HEX INVERTER 14TSSOP | Forespørgsel |
|
74LVCU04APW,112 | Nexperia USA Inc. | IC HEX INVERTER 14TSSOP | Forespørgsel |
 |
74LVCU04AD,118 | Nexperia USA Inc. | IC HEX INVERTER 14-SOIC | Forespørgsel |
|
74LVCU04ADB,118 | Nexperia USA Inc. | IC HEX INVERTER 14SSOP | Forespørgsel |
|
74LVCU04AD,112 | Nexperia USA Inc. | IC HEX INVERTER 14SOIC | Forespørgsel |
 |
74LVCU04ABQ,115 | Nexperia USA Inc. | IC HEX INVERTER 14DHVQFN | Forespørgsel |
Laast News
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- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
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- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers