Købe 74SSTUB32868ZRHR med BYCHPS
Køb med garanti
74SSTUB32868ZRHR
- Varenummer:
- 74SSTUB32868ZRHR
- Fabrikant:
- Beskrivelse:
- IC CONFIG REG BUFF 28BIT 176-BGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19261 Pieces
- Datablad:
- 74SSTUB32868ZRHR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 74SSTUB32868ZRHR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 74SSTUB32868ZRHR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Forsyningsspænding: | 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Device Package: | 176-NFBGA (6x15) |
| Serie: | 74SSTUB |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 176-BGA |
| Andre navne: | 296-22074-2 |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal bitter: | 28 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | 74SSTUB32868ZRHR |
| Logik Type: | 1:2 Configurable Registered Buffer with Parity |
| Udvidet beskrivelse: | 1:2 Configurable Registered Buffer with Parity IC 176-NFBGA (6x15) |
| Beskrivelse: | IC CONFIG REG BUFF 28BIT 176-BGA |
| Email: | [email protected] |
Relaterede dele til 74SSTUB32868ZRHR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
74SSTUB32864AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Forespørgsel |
|
74SSTUB32866AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Forespørgsel |
|
74SSTUB32865AZJBR | Texas Instruments | IC REGSTR BUFF 28-56BIT 160NFBGA | Forespørgsel |
|
74SSTUB32865ZJBR | Texas Instruments | IC REGISTERED BUFFER 160-TFBGA | Forespørgsel |
|
74SSTUB32868AZRHR | Texas Instruments | IC REGSTR BUFFER 28-56BIT 176BGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers