Købe 77F3R3K-TR-RC med BYCHPS
Køb med garanti
77F3R3K-TR-RC
- Varenummer:
- 77F3R3K-TR-RC
- Fabrikant:
- Bourns, Inc.
- Beskrivelse:
- FIXED IND 3.3UH 670MA 300 MOHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19119 Pieces
- Datablad:
- 77F3R3K-TR-RC.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 77F3R3K-TR-RC, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 77F3R3K-TR-RC via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±10% |
| Leverandør Device Package: | - |
| Størrelse / Dimension: | 0.157" Dia x 0.410" L (3.99mm x 10.41mm) |
| Afskærmning: | Unshielded |
| Serie: | 77F |
| Vurderinger: | - |
| Q @ Freq: | 60 @ 7.96MHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Axial |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Ferrite |
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | 77F3R3K-TR-RC |
| selvinduktion: | 3.3µH |
| Højde - Siddende (Max): | - |
| Frekvens - Test: | 7.96MHz |
| Frekvens - Selvresonans: | 94MHz |
| Udvidet beskrivelse: | 3.3µH Unshielded Wirewound Inductor 670mA 300 mOhm Max Axial |
| Beskrivelse: | FIXED IND 3.3UH 670MA 300 MOHM |
| DC-resistens (DCR): | 300 mOhm Max |
| Nuværende vurdering: | 670mA |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til 77F3R3K-TR-RC
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog