Købe 78438323022 med BYCHPS
Køb med garanti
78438323022
- Varenummer:
- 78438323022
- Fabrikant:
- Wurth Electronics
- Beskrivelse:
- FIXED IND 2.2UH 1.3A 176 MOHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13909 Pieces
- Datablad:
- 1.78438323022.pdf2.78438323022.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 78438323022, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 78438323022 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Molded |
|---|---|
| Tolerance: | ±30% |
| Leverandør Device Package: | 2510 |
| Størrelse / Dimension: | 0.098" L x 0.079" W (2.50mm x 2.00mm) |
| Afskærmning: | Shielded |
| Serie: | WE-MAIA |
| Vurderinger: | AEC-Q200 |
| Q @ Freq: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1008 (2520 Metric) |
| Andre navne: | 732-6914-2 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Iron Alloy |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 78438323022 |
| selvinduktion: | 2.2µH |
| Højde - Siddende (Max): | 0.039" (1.00mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | 60MHz |
| Udvidet beskrivelse: | 2.2µH Shielded Molded Inductor 1.3A 176 mOhm Max 1008 (2520 Metric) |
| Beskrivelse: | FIXED IND 2.2UH 1.3A 176 MOHM |
| DC-resistens (DCR): | 176 mOhm Max |
| Nuværende vurdering: | 1.3A |
| Nuværende - Mætning: | 2.5A |
| Email: | [email protected] |
Relaterede dele til 78438323022
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers