Købe 8870840000 med BYCHPS
Køb med garanti
8870840000
- Varenummer:
- 8870840000
- Fabrikant:
- Weidmuller
- Beskrivelse:
- SRC 1 QV
- Blyfri Status / RoHS Status:
- Blyfri ved fritagelse / RoHS i overensstemmelse med fritagelse
- Tilgængelig mængde:
- 12620 Pieces
- Datablad:
- 8870840000.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 8870840000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 8870840000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| specifikationer: | 12A |
|---|---|
| Serie: | SRC |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | 8870840000 |
| Til brug med / relaterede produkter: | RCI Series |
| Udvidet beskrivelse: | Jumpers RCI Series |
| Beskrivelse: | SRC 1 QV |
| Farve: | - |
| Tilbehørstype: | Jumpers |
| Email: | [email protected] |
Relaterede dele til 8870840000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
5-1415037-1 | TE Connectivity Potter & Brumfield Relays | RETAINING CLIP FOR 29MM PT78 | Forespørgsel |
 |
AQP811 | Panasonic Electric Works | HEAT SINK STD FOR 10A & 15A | Forespørgsel |
 |
J7TKN-A-E6 | Omron Automation and Safety | RELAY THERMAL OVERLOAD 0.4-0.6A | Forespørgsel |
 |
8870830000 | Weidmuller | RIM-I 1 R 110/230V | Forespørgsel |
|
Y92B-P50 | Omron Automation and Safety | HEAT SINK 1.67DEGC/W FOR G3PB | Forespørgsel |
 |
8870850000 | Weidmuller | CONN JUMPER 12A 23MM | Forespørgsel |
 |
HS-2 | Crydom Co. | HEATSINK FOR SSR 0-25A 4.1"X3.4" | Forespørgsel |
 |
HS122 | Crydom Co. | HEATSINK SSR 1.2DEG C/W PNL MNT | Forespørgsel |
 |
KS-300 | Crydom Co. | PROTECTIVE COVER FOR 53TP SER | Forespørgsel |
|
Y92B-P250 | Omron Automation and Safety | HEAT SINK 0.36DEGC/W FOR G3PB | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog