Købe 9TCS1082BNLG8 med BYCHPS
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9TCS1082BNLG8
- Varenummer:
- 9TCS1082BNLG8
- Fabrikant:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC CLOCK SYNT/TEMP SENSOR 32QFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12893 Pieces
- Datablad:
- 9TCS1082BNLG8.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 9TCS1082BNLG8, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 9TCS1082BNLG8 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3.135 V ~ 3.465 V |
|---|---|
| Leverandør Device Package: | 32-VFQFPN (5x5) |
| Serie: | Mobile Access™ |
| Forhold - Indgang: Output: | 1:4 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 32-VFQFN Exposed Pad |
| PLL: | Yes with Bypass |
| Produktion: | Clock |
| Andre navne: | IDT9TCS1082BNLG8 IDT9TCS1082BNLG8-ND |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | 9TCS1082BNLG8 |
| Input: | Crystal |
| Frekvens - Maks: | 48MHz |
| Divider / Multiplikator: | Yes/No |
| Differential - Input: Output: | No/No |
| Beskrivelse: | IC CLOCK SYNT/TEMP SENSOR 32QFN |
| Email: | [email protected] |
Relaterede dele til 9TCS1082BNLG8
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
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9TCS1082BNLG | IDT, Integrated Device Technology Inc | IC CLOCK SYNT/TEMP SENSOR 32QFN | Forespørgsel |
|
9TCS1083BNLG8 | IDT, Integrated Device Technology Inc | IC CLOCK/TEMP/FAN CONT 32VQFN | Forespørgsel |
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9TCS1085BNLG8 | IDT, Integrated Device Technology Inc | IC THERM SENSOR/FAN CTLR 32MLF | Forespørgsel |
|
9TCS1083BNLG | IDT, Integrated Device Technology Inc | IC CLOCK/TEMP/FAN CONT 32VQFN | Forespørgsel |
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9TCS1085BNLG | IDT, Integrated Device Technology Inc | IC THERM SENSOR/FAN CTLR 32MLF | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers