Købe A700W107M002ATE009 med BYCHPS
Køb med garanti
A700W107M002ATE009
- Varenummer:
- A700W107M002ATE009
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP ALUM POLY 100UF 20% 2V SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16430 Pieces
- Datablad:
- A700W107M002ATE009.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for A700W107M002ATE009, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til A700W107M002ATE009 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 2V |
|---|---|
| Type: | Polymer |
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| Størrelse / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| Serie: | AO-Cap A700 |
| Ripple Current - Lavfrekvens: | - |
| Ripple Current - High Frequency: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 2917 (7343 Metric) |
| Andre navne: | 399-5484-2 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | A700W107M002ATE009 |
| Levetid @ Temp.: | - |
| Blyafstand: | - |
| Impedans: | - |
| Højde - Siddende (Max): | 0.059" (1.50mm) |
| Udvidet beskrivelse: | 100µF ±20% 2V Aluminum Polymer Capacitor 2917 (7343 Metric) 9 mOhm |
| ESR (Equivalent Series Resistance): | 9 mOhm |
| Beskrivelse: | CAP ALUM POLY 100UF 20% 2V SMD |
| kapacitans: | 100µF |
| Applikationer: | - |
| Email: | [email protected] |
Relaterede dele til A700W107M002ATE009
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers