Købe AB3X2X4.5W med BYCHPS
Køb med garanti
AB3X2X4.5W
- Varenummer:
- AB3X2X4.5W
- Fabrikant:
- Toshiba Semiconductor
- Beskrivelse:
- FERRITE CORE SOLID 1.5MM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14211 Pieces
- Datablad:
- AB3X2X4.5W.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for AB3X2X4.5W, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til AB3X2X4.5W via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | Amobeads® |
| Vurderinger: | - |
| Ydermål: | 0.157" Dia (4.00mm) |
| Andre navne: | AB3X2X45W |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | - |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | AB3X2X4.5W |
| Længde: | 0.236" (6.00mm) |
| Indvendig Dimension: | 0.059" Dia (1.50mm) |
| Impedans @ Frekvens: | - |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core ID 0.059" Dia (1.50mm) OD 0.157" Dia (4.00mm) Length 0.236" (6.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE SOLID 1.5MM |
| Email: | [email protected] |
Relaterede dele til AB3X2X4.5W
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
AB3X2X4.5DY | Toshiba Semiconductor and Storage | FERRITE CORE SOLID | Forespørgsel |
 |
FSRB090080RNB00B | Murata Electronics North America | FERRITE CORE 466 OHM SOLID 5MM | Forespørgsel |
 |
74275812 | Wurth Electronics Inc. | FERRITE CORE 200 OHM HINGED 5MM | Forespørgsel |
 |
AB3X2X6W | Toshiba Semiconductor and Storage | FERRITE CORE SOLID 1.5MM | Forespørgsel |
 |
28A2432-0A2 | Laird-Signal Integrity Products | FERRITE CORE 160 OHM HINGED | Forespørgsel |
 |
FB64-110-RC | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørgsel |
 |
AB3X2X3W | Toshiba Semiconductor and Storage | FERRITE CORE SOLID 1.5MM | Forespørgsel |
 |
28B0591-200 | Laird-Signal Integrity Products | FERRITE CORE 377 OHM SOLID 5.9MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog