Købe ACASN5001S5001P1AT med BYCHPS
Køb med garanti
ACASN5001S5001P1AT
- Varenummer:
- ACASN5001S5001P1AT
- Fabrikant:
- Draloric / Vishay
- Beskrivelse:
- RES ARRAY 2 RES 5K OHM 0606
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16130 Pieces
- Datablad:
- ACASN5001S5001P1AT.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ACASN5001S5001P1AT, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ACASN5001S5001P1AT via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±0.1% |
|---|---|
| Temperaturkoefficient: | ±25ppm/°C |
| Leverandør Device Package: | 0606 |
| Størrelse / Dimension: | 0.063" L x 0.059" W (1.60mm x 1.50mm) |
| Serie: | ACA - Precision |
| Modstand (ohm): | 5k |
| Strøm pr. Element: | 125mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0606, Convex |
| Andre navne: | 749-1052-2 ACASN5001S5001P1AT-ND |
| Driftstemperatur: | -55°C ~ 155°C |
| Antal modstande: | 2 |
| Antal stifter: | 4 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | ACASN5001S5001P1AT |
| Højde - Siddende (Max): | 0.022" (0.55mm) |
| Udvidet beskrivelse: | 5k Ohm ±0.1% 125mW Power Per Element Isolated Resistor Network/Array ±25ppm/°C 0606, Convex |
| Beskrivelse: | RES ARRAY 2 RES 5K OHM 0606 |
| Kredsløbstype: | Isolated |
| Applikationer: | Automotive AEC-Q200, Voltage Divider (TCR Matched) |
| Email: | [email protected] |
Relaterede dele til ACASN5001S5001P1AT
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers