Købe ACB2012L-060-T med BYCHPS
Køb med garanti
ACB2012L-060-T
- Varenummer:
- ACB2012L-060-T
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- FERRITE BEAD 60 OHM 0805 1LN
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12814 Pieces
- Datablad:
- ACB2012L-060-T.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ACB2012L-060-T, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ACB2012L-060-T via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Størrelse / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
|---|---|
| Serie: | ACB |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0805 (2012 Metric) |
| Driftstemperatur: | - |
| Antal linjer: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | ACB2012L-060-T |
| Impedans @ Frekvens: | 60 Ohm @ 100MHz |
| Højde (Max): | 0.043" (1.10mm) |
| Filter Type: | Signal Line |
| Beskrivelse: | FERRITE BEAD 60 OHM 0805 1LN |
| DC-modstand (DCR) (Max): | 400 mOhm |
| Nuværende vurdering (Max): | 400mA |
| Email: | [email protected] |
Relaterede dele til ACB2012L-060-T
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ACB2012M-040-T | TDK Corporation | FERRITE BEAD 40 OHM 0805 1LN | Forespørgsel |
|
ACB2012L-015-T | TDK Corporation | FERRITE BEAD 15 OHM 0805 1LN | Forespørgsel |
|
ACB2012H-030-T | TDK Corporation | FERRITE BEAD 30 OHM 0805 1LN | Forespørgsel |
|
ACB2012H-015-T | TDK Corporation | FERRITE BEAD 15 OHM 0805 1LN | Forespørgsel |
|
ACB2012H-060-T | TDK Corporation | FERRITE BEAD 60 OHM 0805 1LN | Forespørgsel |
|
ACB2012L-030-T | TDK Corporation | FERRITE BEAD 30 OHM 0805 1LN | Forespørgsel |
|
ACB2012M-080-T | TDK Corporation | FERRITE BEAD 80 OHM 0805 1LN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers