Købe ADM3315EACPZ-REEL7 med BYCHPS
Køb med garanti
ADM3315EACPZ-REEL7
- Varenummer:
- ADM3315EACPZ-REEL7
- Fabrikant:
- AD
- Beskrivelse:
- IC TXRX RS-232 3:3 2.7V 32LFCSP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16729 Pieces
- Datablad:
- ADM3315EACPZ-REEL7.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ADM3315EACPZ-REEL7, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ADM3315EACPZ-REEL7 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.7 V ~ 3.6 V |
|---|---|
| Type: | Transceiver |
| Leverandør Device Package: | 32-LFCSP-WQ (5x5) |
| Serie: | - |
| Modtager Hysterese: | 140mV |
| protokol: | RS232 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 32-WFQFN Exposed Pad, CSP |
| Andre navne: | ADM3315EACPZ-REEL7-ND ADM3315EACPZ-REEL7TR |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal drivere / modtagere: | 3/3 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 23 Weeks |
| Producentens varenummer: | ADM3315EACPZ-REEL7 |
| Udvidet beskrivelse: | 3/3 Transceiver Full RS232 32-LFCSP-WQ (5x5) |
| Duplex: | Full |
| Beskrivelse: | IC TXRX RS-232 3:3 2.7V 32LFCSP |
| Datahastighed: | 460Kbps |
| Email: | [email protected] |
Relaterede dele til ADM3315EACPZ-REEL7
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog