Købe ADUC7021BCPZ62 med BYCHPS
Køb med garanti
ADUC7021BCPZ62
- Varenummer:
- ADUC7021BCPZ62
- Fabrikant:
- AD
- Beskrivelse:
- IC MCU 32BIT 62KB FLASH 40LFCSP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12920 Pieces
- Datablad:
- ADUC7021BCPZ62.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ADUC7021BCPZ62, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ADUC7021BCPZ62 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 2.7 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 40-LFCSP-VQ (6x6) |
| Fart: | 44MHz |
| Serie: | MicroConverter® ADuC7xxx |
| RAM-størrelse: | 2K x 32 |
| Programhukommelsestype: | FLASH |
| Programhukommelsesstørrelse: | 62KB (31K x16) |
| tilbehør: | PLA, PWM, PSM, Temp Sensor, WDT |
| Emballage: | Tray |
| Pakke / tilfælde: | 40-VFQFN Exposed Pad, CSP |
| Oscillator Type: | Internal |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Antal I / O: | 13 |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 26 Weeks |
| Producentens varenummer: | ADUC7021BCPZ62 |
| Udvidet beskrivelse: | ARM7® MicroConverter® ADuC7xxx Microcontroller IC 16/32-Bit 44MHz 62KB (31K x16) FLASH 40-LFCSP-VQ (6x6) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT 62KB FLASH 40LFCSP |
| Datakonvertere: | A/D 8x12b, D/A 2x12b |
| Core Size: | 16/32-Bit |
| Core Processor: | ARM7® |
| Connectivity: | EBI/EMI, I²C, SPI, UART/USART |
| Email: | [email protected] |
Relaterede dele til ADUC7021BCPZ62
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers