Købe AFE1256GBTD med BYCHPS
Køb med garanti
AFE1256GBTD
- Varenummer:
- AFE1256GBTD
- Fabrikant:
- Beskrivelse:
- IC AFE DIGTIAL X-RAY DIE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19344 Pieces
- Datablad:
- AFE1256GBTD.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for AFE1256GBTD, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til AFE1256GBTD via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Digital: | - |
|---|---|
| Spænding - Supply, Analog: | - |
| Leverandør Device Package: | Die |
| Serie: | - |
| Power (Watts): | - |
| Emballage: | Tube |
| Pakke / tilfælde: | Die |
| Antal kanaler: | 256 |
| Antal bitter: | 16 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | AFE1256GBTD |
| Udvidet beskrivelse: | 256 Channel AFE 16 Bit Die |
| Beskrivelse: | IC AFE DIGTIAL X-RAY DIE |
| Email: | [email protected] |
Relaterede dele til AFE1256GBTD
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
AFE1230E/1KG4 | Texas Instruments | IC ANALOG FRNT END HDSL 28-SSOP | Forespørgsel |
|
AFE1230E | Texas Instruments | IC ANALOG FRNT END HDSL 28-SSOP | Forespørgsel |
|
AFE1205E/1K | Texas Instruments | IC HDSL ANALOG FRONT END 48SSOP | Forespørgsel |
|
VSP01M02ZWDR | Texas Instruments | IC AFE 12BIT 36MHZ 100BGA | Forespørgsel |
|
AFE1256TDS | Texas Instruments | IC AFE DIGTIAL X-RAY 314 COF | Forespørgsel |
|
AFE1230E/1K | Texas Instruments | IC ANALOG FRNT END HDSL 28-SSOP | Forespørgsel |
|
AFE1205E | Texas Instruments | IC HDSL ANALOG FRONT END 48SSOP | Forespørgsel |
|
AFE1224E/1K | Texas Instruments | IC HDSL ANALOG FRONT END 28SSOP | Forespørgsel |
|
AFE1224E | Texas Instruments | IC HDSL ANALOG FRONT END 28SSOP | Forespørgsel |
|
AFE1203E/1K | Texas Instruments | IC HDSL ANALOG FRONT END 48SSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers