Købe AISM-1812-R33M-T med BYCHPS
Køb med garanti
AISM-1812-R33M-T
- Varenummer:
- AISM-1812-R33M-T
- Fabrikant:
- Abracon Corporation
- Beskrivelse:
- FIXED IND 330NH 605MA 300 MOHM
- Blyfri Status / RoHS Status:
- Indeholder lead / RoHS-kompatibel
- Tilgængelig mængde:
- 12581 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for AISM-1812-R33M-T, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til AISM-1812-R33M-T via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | 1812 |
| Størrelse / Dimension: | 0.177" L x 0.126" W (4.50mm x 3.20mm) |
| Afskærmning: | Unshielded |
| Serie: | AISM-1812 |
| Vurderinger: | - |
| Q @ Freq: | 40 @ 25.2MHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1812 (4532 Metric) |
| Andre navne: | AISM-1812-R33M-TTR AISM1812R33MT |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Ferrite |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | AISM-1812-R33M-T |
| selvinduktion: | 330nH |
| Højde - Siddende (Max): | 0.110" (2.80mm) |
| Frekvens - Test: | 25.2MHz |
| Frekvens - Selvresonans: | 165MHz |
| Udvidet beskrivelse: | 330nH Unshielded Wirewound Inductor 605mA 300 mOhm Max 1812 (4532 Metric) |
| Beskrivelse: | FIXED IND 330NH 605MA 300 MOHM |
| DC-resistens (DCR): | 300 mOhm Max |
| Nuværende vurdering: | 605mA |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til AISM-1812-R33M-T
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers