Købe AMK105BJ225MP-F med BYCHPS
Køb med garanti
AMK105BJ225MP-F
- Varenummer:
- AMK105BJ225MP-F
- Fabrikant:
- Taiyo Yuden
- Beskrivelse:
- CAP ,MLCC ,0402,4V ,X5R,2.2UF20%
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16318 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for AMK105BJ225MP-F, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til AMK105BJ225MP-F via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | 587-5398-2 RM AMK105 BJ225MP-F |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | AMK105BJ225MP-F |
| Udvidet beskrivelse: | Ceramic Capacitor |
| Beskrivelse: | CAP ,MLCC ,0402,4V ,X5R,2.2UF20% |
| Email: | [email protected] |
Relaterede dele til AMK105BJ225MP-F
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
AMK105BJ474MH-R | Taiyo Yuden | CAP CER 0.47UF 4V X5R 0402 | Forespørgsel |
|
AMK105BJ225MVHF | Taiyo Yuden | CAP CER 2.2UF 4V X5R 0402 | Forespørgsel |
|
AMK105BBJ475MVHF | Taiyo Yuden | CAP CER 4.7UF 4V X5R 0402 | Forespørgsel |
 |
AMK107BJ225KV-T | Taiyo Yuden | CAP CER 2.2UF 4V X5R 0603 | Forespørgsel |
|
AMK105BJ225MV-F | Taiyo Yuden | CAP CER 2.2UF 4V X5R 0402 | Forespørgsel |
|
AMK105BJ105ME-R | Taiyo Yuden | CAP CER 1UF 4V X5R 0402 | Forespørgsel |
|
AMK105F105ZV-F | Taiyo Yuden | CAP CER 1UF 4V Y5V 0402 | Forespørgsel |
|
AMK105CBJ106MVHF | Taiyo Yuden | CAP CER 10UF 4V X5R 0402 | Forespørgsel |
 |
AMK105ABJ475MV-F | Taiyo Yuden | CAP, MLCC, 0402, 4V, X5R, 4.7UF | Forespørgsel |
|
AMK105BJ335MV-F | Taiyo Yuden | CAP CER 3.3UF 4V X5R 0402 | Forespørgsel |
|
AMK105CBJ106MV-F | Taiyo Yuden | CAP CER 10UF 4V X5R 0402 | Forespørgsel |
|
AMK105BJ475MV-F | Taiyo Yuden | CAP CER 4.7UF 4V X5R 0402 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers