Købe AS6C2016-55BIN med BYCHPS
Køb med garanti
AS6C2016-55BIN
- Varenummer:
- AS6C2016-55BIN
- Fabrikant:
- Alliance Memory, Inc.
- Beskrivelse:
- IC SRAM 2MBIT 55NS 48TFBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17290 Pieces
- Datablad:
- AS6C2016-55BIN.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for AS6C2016-55BIN, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til AS6C2016-55BIN via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.7 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 48-TFBGA (6x8) |
| Fart: | 55ns |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 48-TFBGA |
| Andre navne: | 1450-1175 AS6C2016-55BIN-ND |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Volatile |
| Hukommelsesstørrelse: | 2Mb (128K x 16) |
| Hukommelsesformat: | SRAM |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | AS6C2016-55BIN |
| grænseflade: | Parallel |
| Beskrivelse: | IC SRAM 2MBIT 55NS 48TFBGA |
| Email: | [email protected] |
Relaterede dele til AS6C2016-55BIN
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers