Købe AS8C803625A-QC75N med BYCHPS
Køb med garanti
AS8C803625A-QC75N
- Varenummer:
- AS8C803625A-QC75N
- Fabrikant:
- Alliance Memory, Inc.
- Beskrivelse:
- IC SRAM 9MBIT 7.5NS 100TQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16253 Pieces
- Datablad:
- AS8C803625A-QC75N.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for AS8C803625A-QC75N, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til AS8C803625A-QC75N via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3.135 V ~ 3.465 V |
|---|---|
| Leverandør Device Package: | 100-TQFP (14x20) |
| Fart: | 100MHz |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 100-LQFP |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsestype: | Volatile |
| Hukommelsesstørrelse: | 9Mb (256K x 36) |
| Hukommelsesformat: | SRAM |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | AS8C803625A-QC75N |
| grænseflade: | Parallel |
| Beskrivelse: | IC SRAM 9MBIT 7.5NS 100TQFP |
| Email: | [email protected] |
Relaterede dele til AS8C803625A-QC75N
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
AS8C801825-QC75N | Alliance Memory, Inc. | IC SRAM 9MBIT 7.5NS 100TQFP | Forespørgsel |
|
AS8C803625-QC75N | Alliance Memory, Inc. | IC SRAM 9MBIT 7.5NS 100TQFP | Forespørgsel |
|
AS8C801800-QC150N | Alliance Memory, Inc. | IC SRAM 9MBIT 150MHZ 100TQFP | Forespørgsel |
|
AS8C803600-QC150N | Alliance Memory, Inc. | IC SRAM 9MBIT 150MHZ 100TQFP | Forespørgsel |
|
AS8C801801-QC150N | Alliance Memory, Inc. | IC SRAM 9MBIT 150MHZ 100TQFP | Forespørgsel |
|
AS8C803601-QC150N | Alliance Memory, Inc. | IC SRAM 9MBIT 150MHZ 100TQFP | Forespørgsel |
|
AS8C801825A-QC75N | Alliance Memory, Inc. | IC SRAM 9MBIT 7.5NS 100TQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers