Købe ASMPH-0603-2R2M-T med BYCHPS
Køb med garanti
ASMPH-0603-2R2M-T
- Varenummer:
- ASMPH-0603-2R2M-T
- Fabrikant:
- Abracon Corporation
- Beskrivelse:
- FIXED IND 2.2UH 850MA 300 MOHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16072 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for ASMPH-0603-2R2M-T, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ASMPH-0603-2R2M-T via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Multilayer |
|---|---|
| Tolerance: | ±20% |
| Leverandør Device Package: | 0603 (1608 Metric) |
| Størrelse / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| Afskærmning: | Shielded |
| Serie: | ASMPH-0603 |
| Vurderinger: | - |
| Q @ Freq: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0603 (1608 Metric) |
| Andre navne: | 535-12265-2 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Ferrite |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | ASMPH-0603-2R2M-T |
| selvinduktion: | 2.2µH |
| Højde - Siddende (Max): | 0.037" (0.95mm) |
| Frekvens - Selvresonans: | 80MHz |
| Udvidet beskrivelse: | 2.2µH Shielded Multilayer Inductor 850mA 300 mOhm 0603 (1608 Metric) |
| Beskrivelse: | FIXED IND 2.2UH 850MA 300 MOHM |
| DC-resistens (DCR): | 300 mOhm |
| Nuværende vurdering: | 850mA |
| Nuværende - Mætning: | 300mA |
| Email: | [email protected] |
Relaterede dele til ASMPH-0603-2R2M-T
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers