Købe B1635-2R5226 med BYCHPS
Køb med garanti
B1635-2R5226
- Varenummer:
- B1635-2R5226
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- CAP 22F -20% +80% 2.5V T/H
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 13178 Pieces
- Datablad:
- B1635-2R5226.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for B1635-2R5226, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til B1635-2R5226 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.650" Dia (16.50mm) |
| Serie: | PowerStor B |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 283-2509 526-2509 526-2509-ND |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B1635-2R5226 |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Blyafstand: | 0.295" (7.50mm) |
| Højde - Siddende (Max): | 1.496" (38.00mm) |
| Udvidet beskrivelse: | 22F -20%, +80%(EDLC) Supercapacitor 2.5V Radial, Can 40 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 40 mOhm @ 1kHz |
| Beskrivelse: | CAP 22F -20% +80% 2.5V T/H |
| kapacitans: | 22F |
| Email: | [email protected] |
Relaterede dele til B1635-2R5226
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FE0H155ZF | KEMET | CAP 1.5F -20% +80% 5.5V T/H | Forespørgsel |
 |
MAL219691123E3 | Vishay BC Components | CAP ALUM 4F 4.2V SNAP | Forespørgsel |
|
MAL219691112E3 | Vishay BC Components | CAP ALUM 4F 2.8V SNAP | Forespørgsel |
 |
B1635-2R5226-R | Eaton | CAP 22F -20% +80% 2.5V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers