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B25832F6155K1
- Varenummer:
- B25832F6155K1
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP FILM 1.5UF 930VAC QC TERM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18439 Pieces
- Datablad:
- B25832F6155K1.pdf
Introduktion
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specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 930V |
| Tolerance: | ±10% |
| Afslutning: | Quick Connect Tab - 0.248" (6.30mm) |
| Størrelse / Dimension: | 1.181" Dia (30.00mm) |
| Serie: | B25832 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | B25832F6155K 1 B25832F6155K001 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B25832F6155K1 |
| Blyafstand: | - |
| Højde - Siddende (Max): | 3.150" (80.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 1.5µF ±10% Film Capacitor 930V Radial, Can |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | - |
| Beskrivelse: | CAP FILM 1.5UF 930VAC QC TERM |
| kapacitans: | 1.5µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
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B25832C4306K9 | EPCOS (TDK) | CAP FILM 30UF 10% 640VAC QC TERM | Forespørgsel |
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B25832B4256K1 | EPCOS (TDK) | CAP FILM 25UF 10% 640VAC QC TERM | Forespørgsel |
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B25832C4256K9 | EPCOS (TDK) | CAP FILM 25UF 10% 640VAC QC TERM | Forespørgsel |
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B25832C4605K9 | EPCOS (TDK) | CAP FILM 6UF 10% 640VAC QC TERM | Forespørgsel |
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B25832C4206K9 | EPCOS (TDK) | CAP FILM 20UF 10% 640VAC QC TERM | Forespørgsel |
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B25832C4336K9 | EPCOS (TDK) | CAP FILM 33UF 10% 640VAC QC TERM | Forespørgsel |
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B25832C6305K9 | EPCOS (TDK) | CAP FILM 3UF 10% 930VAC QC TERM | Forespørgsel |
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B25832C6805K9 | EPCOS (TDK) | CAP FILM 8UF 10% 930VAC QC TERM | Forespørgsel |
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B25832F4255K1 | EPCOS (TDK) | CAP FILM 2.5UF 640VAC QC TERM | Forespørgsel |
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B25832C4156K9 | EPCOS (TDK) | CAP FILM 15UF 10% 640VAC QC TERM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers