Købe B25838T225K4 med BYCHPS
Køb med garanti
B25838T225K4
- Varenummer:
- B25838T225K4
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP FILM 2.2UF 1.4KVAC QC TERM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13196 Pieces
- Datablad:
- B25838T225K4.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for B25838T225K4, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til B25838T225K4 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 1400V (1.4kV) |
| Tolerance: | ±10% |
| Afslutning: | Quick Connect Tab - 0.248" (6.30mm) |
| Størrelse / Dimension: | - |
| Serie: | B25838 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | B25838T 225K 4 B25838T0225K004 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B25838T225K4 |
| Blyafstand: | - |
| Funktioner: | - |
| Udvidet beskrivelse: | 2.2µF ±10% Film Capacitor 1400V (1.4kV) Radial, Can |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | - |
| Beskrivelse: | CAP FILM 2.2UF 1.4KVAC QC TERM |
| kapacitans: | 2.2µF |
| Applikationer: | Damping |
| Email: | [email protected] |
Relaterede dele til B25838T225K4
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
B25838T156J4 | EPCOS (TDK) | CAP FILM 15UF 5% 1.4KVAC QC TERM | Forespørgsel |
|
B25838K8225K1 | EPCOS (TDK) | CAP FILM 2.2UF 1.1KVAC QC TERM | Forespørgsel |
|
B25838T6685K4 | EPCOS (TDK) | CAP FILM 6.8UF 900VAC QC TERM | Forespørgsel |
|
B25838L8226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 1.1KVAC SCREW | Forespørgsel |
|
B25838L6226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 900VAC SCREW | Forespørgsel |
|
B25838K6225K1 | EPCOS (TDK) | CAP FILM 2.2UF 900VAC QC TERM | Forespørgsel |
|
B25838K6105K1 | EPCOS (TDK) | CAP FILM 1UF 10% 900VAC QC TERM | Forespørgsel |
|
B25838T5605K14 | EPCOS (TDK) | CAP FILM 6UF 10% 750VAC QC TERM | Forespørgsel |
|
B25838L8475K4 | EPCOS (TDK) | CAP FILM 4.7UF 10% 1.1KVAC SCREW | Forespørgsel |
|
B25838T8225J4 | EPCOS (TDK) | CAP FILM 2.2UF 1.1KVAC QC TERM | Forespørgsel |
|
B25838L6126K4 | EPCOS (TDK) | CAP FILM 12UF 10% 900VAC SCREW | Forespørgsel |
|
B25838L4106K4 | EPCOS (TDK) | CAP FILM 10UF 10% 600VAC SCREW | Forespørgsel |
|
B25838A8474M | EPCOS (TDK) | CAP FILM 0.47UF 1.1KVAC QC TERM | Forespørgsel |
|
B25838L4226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 600VAC SCREW | Forespørgsel |
|
B25838L4156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 600VAC SCREW | Forespørgsel |
|
B25838L6156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 900VAC SCREW | Forespørgsel |
|
B25838L8156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 1.1KVAC SCREW | Forespørgsel |
|
B25838L8126K4 | EPCOS (TDK) | CAP FILM 12UF 10% 1.1KVAC SCREW | Forespørgsel |
|
B25838T6126K | EPCOS (TDK) | CAP FILM 12UF 10% 440VAC QC TERM | Forespørgsel |
|
B25838L8186K4 | EPCOS (TDK) | CAP FILM 18UF 10% 1.1KVAC SCREW | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers