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B32526T1336K
- Varenummer:
- B32526T1336K
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP FILM 33UF 10% 100VDC RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13700 Pieces
- Datablad:
- B32526T1336K.pdf
Introduktion
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specifikationer
| Spændingsvurdering - DC: | 100V |
|---|---|
| Spændingsbedømmelse - AC: | 63V |
| Tolerance: | ±10% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 1.634" L x 0.945" W (41.50mm x 24.00mm) |
| Serie: | B32526 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 495-4582 B32526T1336K000 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B32526T1336K |
| Blyafstand: | 1.476" (37.50mm) |
| Højde - Siddende (Max): | 0.591" (15.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 33µF ±10% Film Capacitor 63V 100V Polyester, Polyethylene Terephthalate (PET) Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyester, Polyethylene Terephthalate (PET) |
| Beskrivelse: | CAP FILM 33UF 10% 100VDC RADIAL |
| kapacitans: | 33µF |
| Applikationer: | Automotive; EMI, RFI Suppression |
| Email: | [email protected] |
Relaterede dele til B32526T1336K
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|---|---|---|---|---|
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B32526R6106K | EPCOS (TDK) | CAP FILM 10UF 10% 400VDC RADIAL | Forespørgsel |
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B32526R0227K000 | EPCOS (TDK) | CAP FILM 220UF 10% 63VDC RADIAL | Forespørgsel |
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B32526R1336K | EPCOS (TDK) | CAP FILM 33UF 10% 100VDC RADIAL | Forespørgsel |
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Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
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- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers