Købe B32923H3155M000 med BYCHPS
Køb med garanti
B32923H3155M000
- Varenummer:
- B32923H3155M000
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP FILM 1.5UF 20% 305VAC RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15110 Pieces
- Datablad:
- B32923H3155M000.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for B32923H3155M000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til B32923H3155M000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 305V |
| Tolerance: | ±20% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 1.043" L x 0.571" W (26.50mm x 14.50mm) |
| Serie: | Automotive, AEC-Q200, B32923 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 495-7042 B32923H3155M |
| Driftstemperatur: | -40°C ~ 110°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B32923H3155M000 |
| Blyafstand: | 0.886" (22.50mm) |
| Højde - Siddende (Max): | 1.161" (29.50mm) |
| Funktioner: | X2 Safety Rated |
| Udvidet beskrivelse: | 1.5µF ±20% Film Capacitor 305V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 1.5UF 20% 305VAC RADIAL |
| kapacitans: | 1.5µF |
| Applikationer: | EMI, RFI Suppression |
| Email: | [email protected] |
Relaterede dele til B32923H3155M000
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog