Købe B39131B4926H310 med BYCHPS
Køb med garanti
B39131B4926H310
- Varenummer:
- B39131B4926H310
- Fabrikant:
- Epcos / RF360
- Beskrivelse:
- IF 133.20 MHZ
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19909 Pieces
- Datablad:
- B39131B4926H310.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for B39131B4926H310, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til B39131B4926H310 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Størrelse / Dimension: | 0.276" Dia x 0.197" L (7.00mm x 5.00mm) |
|---|---|
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 10-SMD, No Lead |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B39131B4926H310 |
| Højde (Max): | 0.058" (1.48mm) |
| Beskrivelse: | IF 133.20 MHZ |
| Email: | [email protected] |
Relaterede dele til B39131B4926H310
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
B39431B3555U310W3 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 433.92MHZ REMOTE SMD | Forespørgsel |
 |
B39122B1603Z810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | LOW LOSS 1220 MHZ | Forespørgsel |
|
B39931B4063U810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | DUPLEXER RF 926.25&903.75MHZ SMD | Forespørgsel |
|
B39132B5103U810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | RF 1260.00MHZ | Forespørgsel |
|
B39131B3647Z710 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 125MHZ LOWLOSS SMD | Forespørgsel |
|
B39132B1642U810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 1.25GHZ SAT SMD | Forespørgsel |
|
B39901B4330P810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | CSSP3 FILTER CU-FRAME | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers