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B43564E2159M7
- Varenummer:
- B43564E2159M7
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP ALUM 15000UF 20% 200V SCREW
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15982 Pieces
- Datablad:
- B43564E2159M7.pdf
Introduktion
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specifikationer
| Spændingsbedømmelse: | 200V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 3.028" Dia (76.90mm) |
| Serie: | B43564 |
| Ripple Current: | 25.6A @ 100Hz |
| Polarisering: | Polar |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Screw Terminals |
| Andre navne: | B43564E2159M007 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B43564E2159M7 |
| Levetid @ Temp.: | 15000 Hrs @ 85°C |
| Blyafstand: | 1.248" (31.70mm) |
| Impedans: | 10 mOhm |
| Højde - Siddende (Max): | 5.677" (144.20mm) |
| Udvidet beskrivelse: | 15000µF 200V Aluminum Capacitors Radial, Can - Screw Terminals 12 mOhm @ 100Hz 15000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 12 mOhm @ 100Hz |
| Beskrivelse: | CAP ALUM 15000UF 20% 200V SCREW |
| kapacitans: | 15000µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til B43564E2159M7
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B43564E2828M3 | EPCOS (TDK) | CAP ALUM 8200UF 20% 200V SCREW | Forespørgsel |
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B43564E2159M3 | EPCOS (TDK) | CAP ALUM 15000UF 20% 200V SCREW | Forespørgsel |
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B43564E2478M | EPCOS (TDK) | CAP ALUM 4700UF 20% 200V SCREW | Forespørgsel |
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B43564E2109M3 | EPCOS (TDK) | CAP ALUM 10000UF 20% 200V SCREW | Forespørgsel |
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B43564E2229M3 | EPCOS (TDK) | CAP ALUM 22000UF 20% 200V SCREW | Forespørgsel |
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B43564E2109M7 | EPCOS (TDK) | CAP ALUM 10000UF 20% 200V SCREW | Forespørgsel |
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B43564E2339M7 | EPCOS (TDK) | CAP ALUM 33000UF 20% 200V SCREW | Forespørgsel |
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B43564E2828M7 | EPCOS (TDK) | CAP ALUM 8200UF 20% 200V SCREW | Forespørgsel |
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B43564E2338M | EPCOS (TDK) | CAP ALUM 3300UF 20% 200V SCREW | Forespørgsel |
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Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
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- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers